| 摘要 |
<p>Provided is a camera module manufacturing method allowing a camera module to be produced in a compact size while suppressing adhesion of flux residue to the imaging surface of an imaging device, improving impact resistance, and enabling formation of high-quality images. Also provided are such a camera module and a portable terminal using said camera module. Chip components (18) are mounted on a solder paste (HP), placed inside a reflow furnace (RF), and kept at or above the melting temperature of the solder. Then, a synthetic resin flux in the solder paste (HP) spreads between the chip components (18) and a wiring pattern, solder particles in the solder paste (HP) melt after oxides are cleaned, and the solder subsequently cools and solidifies after being taken out of the reflow furnace (RF). At this time, residue (FL) of the synthetic resin flux coat the periphery of the solidified solder (HD). However, because the synthetic resin flux residue (FL) does not lose elasticity even when solidified, the flux residue itself not only never peels off but also has a function of preventing the solder (HD) from falling off upon impact. In addition, by coating the soldered chip components (18) and terminals of the wiring pattern with the synthetic resin flux residue (FL), moisture resistance is also improved.</p> |
