| 摘要 |
PROBLEM TO BE SOLVED: To minimize degradation of sealability at a seal bond, in an electronic controller of electromechanical integrated structure.SOLUTION: In an electronic controller 3 having a case 12 and a cover 15 for housing a circuit board, in which a portion of the bottom wall of the case 12 is seal bonded to a cylindrical wall 10 forming the opening 11 of an electric motor 2, a protrusion 71 protruding to the electric motor 2 side is formed on the farther outer edge side than the seal bond to the cylindrical wall 10 of the electric motor 2 on the bottom wall of the case 12. The length of the protrusion 71 in the protruding direction is set shorter than the shortest length causing capillary phenomenon for drawing moisture between the protrusion 71 and the cylindrical wall 10 of the electric motor 2. |
