发明名称 DEVICE FOR TREATING SURFACE OF WAFER-LIKE ARTICLE
摘要 <p>PROBLEM TO BE SOLVED: To provide a method of preventing the used liquid of a surface treatment process device from adhering to a process chamber.SOLUTION: A device for liquid treatment of a substrate includes a substrate holder, and a liquid collector surrounding the substrate holder. The liquid collector includes a groove for collecting the liquid used for treating the substrate. The groove is communicating with a discharge tube, and the liquid collector further includes a concave surface spreading from a discharge opening in the groove to the inlet opening of the discharge tube positioned lower than the groove. The discharge opening in the groove has a cross-sectional area at least two times that of the inlet opening of the discharge tube.</p>
申请公布号 JP2014187363(A) 申请公布日期 2014.10.02
申请号 JP20140051469 申请日期 2014.03.14
申请人 LAM RESEARCH AG 发明人 ANDREAS GLEISSNER
分类号 H01L21/304;H01L21/02;H01L21/306;H01L21/683 主分类号 H01L21/304
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