发明名称 SiGe SRAM BUTTED CONTACT RESISTANCE IMPROVEMENT
摘要 The present disclosure relates to a method for fabricating a butted a contact arrangement configured to couple two transistors, wherein an active region of a first transistor is coupled to a gate of a second transistor. The gate of the second transistor is formed from a gate material which comprises a dummy gate of the first transistor, and is configured to straddle a boundary between the active region of the first transistor and an isolation layer formed about the first transistor. The butted a contact arrangement results in a decreased contact resistance for the butted contact as compared to previous methods.
申请公布号 US2014295630(A1) 申请公布日期 2014.10.02
申请号 US201414305427 申请日期 2014.06.16
申请人 Taiwan Semiconductor Manufacturing Co., Ltd. 发明人 Chen Chao-Hsuing;Wang Ling-Sung;Lin Chi-Yen
分类号 H01L21/8238;H01L29/165 主分类号 H01L21/8238
代理机构 代理人
主权项 1. A method, comprising: forming a first gate structure over a first active region of a substrate to form a first transistor, wherein the first gate structure also extends at least partially over a second active region of the substrate to establish a dummy gate over the second active region; forming a second gate structure over the second active region to form a second transistor; forming a recess within the second active region between the dummy gate and the second gate structure; forming a source/drain region within the recess; and forming a butted contact to couple the source/drain region to the dummy gate.
地址 Hsin-Chu TW