| 发明名称 |
METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE |
| 摘要 |
A method of manufacturing a light-emitting device includes providing a case including an annular sidewall and an LED chip including a chip substrate and a crystal layer and mounted in a region surrounded by the sidewall of the case, and dripping a droplet of an electrically-charged phosphor-containing resin so as to fill a space between the sidewall and the LED chip. The droplet is attracted toward the sidewall by an electrostatic force during the dripping. |
| 申请公布号 |
US2014295591(A1) |
申请公布日期 |
2014.10.02 |
| 申请号 |
US201414179426 |
申请日期 |
2014.02.12 |
| 申请人 |
TOYODA GOSEI CO., LTD. |
发明人 |
NONOGAWA Takashi;TERAYAMA Takashi;HAYASHI Toshimasa |
| 分类号 |
H01L33/50 |
主分类号 |
H01L33/50 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a light-emitting device, comprising:
providing a case comprising an annular sidewall and an LED chip comprising a chip substrate and a crystal layer and mounted in a region surrounded by the sidewall of the case; and dripping a droplet of an electrically-charged phosphor-containing resin so as to fill a space between the sidewall and the LED chip, wherein the droplet is attracted toward the sidewall by an electrostatic force during the dripping. |
| 地址 |
Kiyosu-shi JP |
