发明名称 ALIGNMENT OF LENS AND IMAGE SENSOR
摘要 Embodiments related to the alignment of a lens with an image sensor in an optical device are disclosed. For example, one disclosed embodiment comprises an optical device including a printed circuit board, and an image sensor package mounted on the printed circuit board, wherein the image sensor package includes an image sensor. The optical system further comprises a lens holder including a lens, and one or more alignment features arranged on the lens holder. The one or more alignment features are configured to contact the image sensor package to mechanically align the lens holder with the image sensor package.
申请公布号 US2014293126(A1) 申请公布日期 2014.10.02
申请号 US201414302307 申请日期 2014.06.11
申请人 Microsoft Corporation 发明人 Yee Dawson
分类号 H04N5/225;G01B11/27 主分类号 H04N5/225
代理机构 代理人
主权项 1. An optical system, comprising: a printed circuit board; an image sensor package mounted on the printed circuit board, the image sensor package including an image sensor; and a lens holder mounted on the printed circuit board and in contact with the printed circuit board, the lens holder including one or more alignment features that contact the image sensor package and mechanically align the lens holder with the image sensor package, the one or more alignment features comprising a recessed portion of the lens holder having one or more protrusions arranged on an inside surface of the recessed portion, the one or more protrusions extending towards the printed circuit board from the inside surface of the recessed portion to a partial depth of the recessed portion, and each protrusion comprising a straight inner edge extending in a direction parallel to a line that forms a first angle with a side of the image sensor package and toward the printed circuit board to an end of the protrusion closest to the printed circuit board, and each protrusion of the one or more protrusions contacting each of one or more sides of the image sensor package along a direction extending toward the printed circuit board while being spaced from the printed circuit board.
地址 Redmond WA US