| 摘要 |
ELECTROMAGNETIC ENERGY SURFACE PROTECTION An electromagnetic energy protection system and method disclosed herein that includes a plurality of conductive sheets (208A, 208B, 208C, 208D, 208E) ohmically connected by conductive interconnects (210A, 210B). The conductive interconnects (210A, 210B) can be metal formed by a metal deposition process. The metal deposition process can include a plasma deposition process. The conductive interconnects (210A, 210B) can help prevent the formation of surface deformities such as bumps that may be caused when connecting, either physically or electrically, adjacent conductive sheets (208A, 208B, 208C, 208D, 208E). (D Cl) w 00 C N/ C'4 o C'4 N/ W Cl) W C) H- 0>- W W C0 M < j CN w C)J -j C ZC/ z z Hz (D Zc H) m 0 0 w i O< < 0 C/ 0 C)0 zC/ D)>- p C)< N 0) |
