| 摘要 |
PROBLEM TO BE SOLVED: To reduce utility of power and the like at operation stop.SOLUTION: A semiconductor wafer W is held between a polishing pad 16 attached to a rotary surface plate 17 of a CMP device 1 and a top ring 18, and relatively rotated and polished. A rinse water flow rate adjustment valve 13 is provided in a rinse water supply pipe 11, and pure water is intermittently supplied to the polishing pad 16 in a polishing part 2 to keep it in a humid condition. The polished semiconductor wafer W is held by cleaning sponge rollers 26 and 27, cleaned, and transported to a cleaning part 3. The rinse water supply pipes 12a and 12b are provided with rinse water flow rate adjustment valves 14 and 14, and pure water is intermittently supplied to the cleaning sponge rollers 26 and 27 to keep them in a humid condition. When a supply interval of the pure water is defined as t minutes, and a supply duration time period of the pure water for each time is defined as dt seconds, the following formula (1): dt=20{1.6-exp(-0.01783 t)}, and the following formula (2): 10≤t≤30 are satisfied. |
