| 摘要 |
PROBLEM TO BE SOLVED: To achieve a semiconductor device which improves reliability of a bonding pad to which a conductive wire is bonded.SOLUTION: A semiconductor device comprises a bonding pad BP which has an OPM (Over Pad Metal) structure and is composed of an Al-Cu alloy film AC2 having a Cu concentration of 2 wt% and over. Since the Al-Cu alloy film AC2 which composes the bonding pad BP becomes hard by increasing the Cu concentration, an impact at bonding of a Cu wire CW causes less deformation of the bonding pad BP and deformation of an OPM film OP1, which is associated with deformation of the bonding pad BP can be reduced. Consequently, stress concentration on the OPM film OP1 caused by the impact of the Cu wire CW can be reduced and breakdown of the OPM film OP1 can be prevented. |
