发明名称 METHOD OF MANUFACTURING CIRCUIT BOARD
摘要 <p>PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit board capable of preventing electrostatic breakdown in a circuit part by improving a short circuit part that short-circuits wiring for protection extending along a predetermined division line with terminals.SOLUTION: When an element substrate 10 used for an electro-optic device is manufactured, a circuit part 11, a plurality of terminals 102, and reactance elements 321 are formed in respective areas of a mother substrate 300 in a first process. In a second process, wiring 310 and 328 are formed for electrically connecting adjacent circuit parts 11 with each other via the reactance element 321. In a third process, the mother substrate 300 is cut along a predetermined division line 303.</p>
申请公布号 JP2014186085(A) 申请公布日期 2014.10.02
申请号 JP20130059560 申请日期 2013.03.22
申请人 SEIKO EPSON CORP 发明人 YAMAJI SHIGEFUMI
分类号 G09F9/00;G02F1/1345;G02F1/1368;H01L29/786 主分类号 G09F9/00
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