发明名称 HEAD SUSPENSION HAVING ACTUATOR IN WHICH PIEZOELECTRIC ELEMENT IS BONDED WITH BONDING TAPE, ACTUATOR AND METHOD OF ATTACHING PIEZOLECTRIC ELEMENT WITH BONDING TAPE
摘要 A head suspension includes a base to be attached to a carriage, a load beam having a rigid part and a resilient part that connects the rigid part to the base, the load beam applying load onto a read/write head, a flexure attached to the load beam and supporting the head, an actuator attaching part located between the base and the head, and a piezoelectric element being deformable in response to a voltage applied thereto to move the head in a sway direction relative to the base. For the head suspension, it bonds the piezoelectric element with a bonding tape to the actuator attaching part and applies an adhesive to fix the piezoelectric element to the actuator attaching part.
申请公布号 US2014290842(A1) 申请公布日期 2014.10.02
申请号 US201414306828 申请日期 2014.06.17
申请人 NHK Spring Co., Ltd. 发明人 ARAI Mikio
分类号 G11B5/127 主分类号 G11B5/127
代理机构 代理人
主权项 1. A method of attaching a piezoelectric element to a head suspension that includes a base to be attached to a carriage and turned around a spindle of the carriage, a load beam having a rigid part and a resilient part, the resilient part connecting the rigid part to the base, the load beam applying load onto a head at a front end distal to the base to write and read information, a flexure attached to the load beam and supporting the head to connect the head to read/write wiring, an actuator attaching part located between the base and the head, to enable the head to be moved in a sway direction relative to the base, and a piezoelectric element fixed to the actuator attaching part, the piezoelectric element being deformable in response to a voltage applied thereto to move the head in the sway direction relative to the base, the method comprising: bonding the piezoelectric element with a bonding tape to the actuator attaching part; and applying an adhesive to fix the piezoelectric element to the actuator attaching part after the bonding step.
地址 Yokohama-shi JP
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