发明名称 LASER MACHINING DEVICE AND LASER MACHINING METHOD
摘要 A laser machining device provided with a laser light source for emitting laser light (L), a spatial light modulator (203) for modulating the laser light (L) emitted by the laser light source, and a light-condensing optical system (204) for condensing on a machining target (1) the laser light modulated by the spatial light modulator (203). The spatial light modulator (203) displays an axicon lens pattern as a modulation pattern when modified regions (7) are formed in a glass portion, whereby the laser light (L) is condensed on the machining target (1) in which a silicon-containing silicon portion is laminated via a resin portion on a glass-containing glass portion for condensing the laser light on the glass portion so that condensation points are formed in multiple positions aligned in proximity along the direction of irradiation of the laser light. The modified regions (7) are thereby formed in the interior of the machining target (1) along a planned cutting line (5), whereby machining quality is improved.
申请公布号 WO2014156688(A1) 申请公布日期 2014.10.02
申请号 WO2014JP56724 申请日期 2014.03.13
申请人 HAMAMATSU PHOTONICS K.K. 发明人 KAWAGUCHI DAISUKE;HIROSE TSUBASA;ARAKI KEISUKE
分类号 B23K26/53;B23K26/06;B23K26/064;B23K26/40;H01L21/301 主分类号 B23K26/53
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