DEVICE AND METHOD OF MANUFACTURING DEVICE

摘要

PROBLEM TO BE SOLVED: To achieve inexpensive, high-reliability joining.SOLUTION: A device includes: a first substrate where a functional element and an electrode are formed; a second substrate where a through electrode is formed; a joining material which joins the first substrate and second substrate together while securing a predetermined interval between the functional element and second substrate; and a conductive material which electrically connects the electrode to the through electrode, the joining material being harder and lower in conductivity than the conductive material.