发明名称 |
METAL COMPOUND, METHOD FOR PREPARING THE SAME, SELECTIVE METALLIZATION OF SURFACE OF SUBSTRATE WITH THE METAL COMPOUND |
摘要 |
The present disclosure provides a metal compound. The metal compound is represented by a formula (I): Cu2AαB2-αO4-β (I). A contains at least one element selected from the groups 6 and 8 of the periodic table. B contains at least one element selected from the group 13 of the periodic table, 0<α<2, and 0<β<1.5. Polymer article containing the metal compound and method for preparing the polymer article as well as selective metallization of a surface of the polymer article are also provided. In addition, the present disclosure provides an ink composition and the selective metallization for a surface of the insulative substrate using the ink composition. |
申请公布号 |
US2014290530(A1) |
申请公布日期 |
2014.10.02 |
申请号 |
US201414242763 |
申请日期 |
2014.04.01 |
申请人 |
BYD COMPANY LIMITED ;SHENZHEN BYD AUTO R&D COMPANY LIMITED |
发明人 |
GONG Qing;ZHOU Wei;MAO Bifeng;MIAO Weifeng |
分类号 |
C23C18/40;H05K3/18 |
主分类号 |
C23C18/40 |
代理机构 |
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代理人 |
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主权项 |
1. A metal compound having a formula (I)
Cu2AαB2-αO4-β (I), wherein A comprises at least one element selected from the groups 6 and 8 of the periodic table, B comprises at least one element selected from the group 13 of the periodic table, 0<α<2, and 0<β<1.5. |
地址 |
Shenzhen CN |