| 主权项 |
1. A stacked semiconductor package comprising:
a semiconductor chip module comprising at least two sub semiconductor chip modules each having a sub substrate and at least two second semiconductor chips stacked on the sub substrate; and a main substrate supporting the semiconductor chip module, wherein the sub substrate comprising:
a support layer;a first semiconductor chip having a first surface with first sub connection pads, and a second surface facing away from the first surface and attached to an upper surface of the support layer;bumps formed on the first bonding pads;an insulation layer covering the upper surface of the support layer including the first semiconductor chip, exposing upper ends of the bumps; andfirst sub connection pads formed on the insulation layer and connecting to the bumps,wherein each of the second semiconductor chips have second bonding pads connected with the first sub connection pads, and the main substrate has main connection pads connected with the respective first sub connection pads,wherein the at least two sub semiconductor chip modules are stacked each other such a manner that the sub substrate of the upper sub semiconductor chip module is attached onto the uppermost the second semiconductor chip of the lower sub semiconductor chip module. |
