SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

摘要

A semiconductor device includes a metallic plate, a bonding layer, a semiconductor chip, and a resin molding. The semiconductor chip is fixed to the metallic plate with the bonding layer. The resin molding is in contact with the metallic plate, and covers the semiconductor chip. In the semiconductor device, a dent is provided in the metallic plate so that the dent is located next to an edge of a fillet of the bonding layer, in a plan view of the metallic plate.

主权项

1. A semiconductor device comprising:
a metallic plate having a dent; a bonding layer; a semiconductor chip fixed to the metallic plate with the bonding layer located between the semiconductor chip and the metallic plate; and a resin molding that is in contact with the metallic plate and covers the semiconductor chip, wherein the dent is located next to an edge of a fillet of the bonding layer, in a plan view of the metallic plate.