| 发明名称 |
Leadframe, Semiconductor Package Including a Leadframe and Method for Producing a Leadframe |
| 摘要 |
A lead frame includes a die pad and a lead finger with an inner portion which is configured to be electrically connected to contact pads of a die and with an outer portion which has an attach portion. The attach portion is configured to be soldered to an external solder pad, wherein the attach portion has a width, a length and a thickness. An opening extends through the thickness of the attach portion. |
| 申请公布号 |
US2014291824(A1) |
申请公布日期 |
2014.10.02 |
| 申请号 |
US201313852058 |
申请日期 |
2013.03.28 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Sivaperumal Seliyan;Liew Wai Win Edwin |
| 分类号 |
H01L23/495;H01L21/48 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A lead frame, comprising:
a die pad configured to accommodate a die; and a lead finger comprising:
an inner portion configured to be electrically coupled to contact pads of the die; andan outer portion comprising an attach portion at an end of the lead finger facing away from the inner portion, the attach portion being configured to be soldered to an external solder pad, wherein the attach portion comprises a first width, a length and a thickness, and wherein an opening extends through the thickness of the attach portion. |
| 地址 |
US |
