| 发明名称 |
METHOD AND DEVICE FOR COOLING SOLDERED PRINTED CIRCUIT BOARDS |
| 摘要 |
Method for cooling soldered printed circuit board modules in a cooling zone of a soldering system, wherein at least one cooling gas comprising inert gas is introduced into the cooling zone, wherein the printed circuit boards are conveyed continuously from a soldering zone of the soldering system into the cooling zone, wherein the cooling gas is generated using liquid cooling gas. The method according to the invention and the device (1) according to the invention advantageously permit highly efficient cooling of printed circuit board modules after the soldering process. The cooling gas may advantageously be used for inerting the soldering system (2) after extraction from the cooling zone (15). |
| 申请公布号 |
US2014290286(A1) |
申请公布日期 |
2014.10.02 |
| 申请号 |
US201214354296 |
申请日期 |
2012.10.22 |
| 申请人 |
L'Air Liquide, Societe Anonyme pour I'Etude et I'Exploitation des Procedes Georges Claude |
发明人 |
Liebert Holger;Ridgeway Patrick;Kast Andre;Coudurier Laurent |
| 分类号 |
H05K1/02 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for cooling soldered printed circuit board modules in a cooling zone of a soldering system, comprising;
introducing at least one cooling gas comprising inert gas into the cooling zone, conveying the printed circuit boards continuously from a soldering zone of the soldering system into the cooling zone, wherein the cooling gas is generated using liquid cooling gas. |
| 地址 |
Paris FR |
