| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat radiation sheet which reduces heat resistance caused by the contact state, improves heat conductivity, and achieves excellent repairability.SOLUTION: A heat radiation sheet is formed by bonding a high heat conduction film, which has heat conductivity higher than a high heat conduction resin sheet, to the high heat conduction resin sheet which may plastically deform at a normal temperature. The structure allows the heating radiation sheet to improve heat conductivity and achieve excellent repairability. The heat radiation sheet is bonded to a printed substrate where heating components are mounted to form a heat radiation structure. |
