| 摘要 |
<p>PROBLEM TO BE SOLVED: To realize the downsizing, low-profiling, and efficient heat radiation of a circuit board part without using a circuit of a dedicated special structure or applying special treatment to the circuit board.SOLUTION: Provided is a circuit board structure in which a plurality of circuit boards 11, 21, mounted with electronic circuit chips 12, 22, 26, 27 that do not necessarily need to be simultaneously driven with high load in order to have a device electrically function, are stacked in the board thickness direction and connected to each other with heat conductors 15, 28. Specifically, when the electronic circuit chips 26, 27 on the one circuit board 21 are driven with high load, the electronic circuit chip 12 on the other circuit board 11 is stopped or driven with low load. The electronic circuit chips 22, 26, 27 for realizing the fundamental function of the device are mounted on the one circuit board 21, and the electronic circuit chip 12 for realizing an additional function of the device is mounted on the other circuit board 11.</p> |
