发明名称 STACKED ELECTROMAGNETIC BANDGAP STRUCTURE
摘要 An EBG (electromagnetic bandgap) device with a stacked structure includes a first ground plane, a first power plane, a via, a second power plane, a second ground plane; a third power plane, and several ground vias. The first ground plane, the second power plane, and the second ground plane are connected through the several ground vias. The ground vias and the second power plane do not have actually electrical connection. The first ground plane, the first power plane, the second power plane, and the via form a first EBG structure and the first ground plane, the second ground plane, the third power plane and the several ground vias form a second EBG structure.
申请公布号 US2014291007(A1) 申请公布日期 2014.10.02
申请号 US201313971859 申请日期 2013.08.21
申请人 HON HAI PRECISION INDUSTRY CO., LTD. 发明人 TANG SHAO-YOU
分类号 H05K1/02 主分类号 H05K1/02
代理机构 代理人
主权项 1. A stacked EBG (electromagnetic bandgap) structure comprising: a first ground plane; a first power plane; a via; a second power plane, connected with the first power plane via the via; a second ground plane; a third power plane, and a plurality of ground vias, wherein the first ground plane, the second power plane and the second ground plane are connected through the ground vias, the ground vias and the second power plane do not have actually electrical connection, the first ground plane, the first power plane, the second power plane, and the via forms a first EBG structure, the first ground plane, the second ground plane, the third power plane and the ground vias forms a second EBG structure.
地址 New Taipei TW