PRINTED CIRCUIT BOARD SOLDER MOUNTING METHOD AND SOLDER MOUNT STRUCTURE

摘要

A printed circuit board solder mounting method of solder-jointing a first-land formed on a first-printed-circuit-board and a second-land formed on a second-printed-circuit-board together, includes: filling a solder-filling-hole with cream solder, the solder-filling-hole provided so as to be open in a planar region of the first-land; arranging a solder-drawing-hole so that the solder-drawing-hole and the solder-filling-hole face each other, the solder-drawing-hole being formed so as to be open in a planar region of the second region, having a center position to be superposed on a center position of the solder-filling-hole, and having a solder wettability higher than a solder wettability of the solder-filling-hole; melting the cream solder in the solder-filling-hole by reflow heating and causing at least part of the cream solder to ascend to the solder-drawing-hole facing the solder-filling-hole; and jointing the first-land and the second-land together by solidifying the cream solder interposed between the first-land and the second-land.

主权项

1. A printed circuit board solder mounting method of solder-jointing a first land formed on a first printed circuit board and a second land formed on a second printed circuit board together, comprising:
filling a solder filling hole with cream solder, the solder filling hole provided so as to be open in a planar region of the first land; arranging a solder drawing hole so that the solder drawing hole and the solder filling hole face each other, the solder drawing hole being formed so as to be open in a planar region of the second region, having a center position to be superposed on a center position of the solder filling hole, and having a solder wettability higher than a solder wettability of the solder filling hole; melting the cream solder in the solder filling hole by reflow heating and causing at least part of the cream solder to ascend to the solder drawing hole facing the solder filling hole; and jointing the first land and the second land together by solidifying the cream solder interposed between the first land and the second land.