| 发明名称 |
METHOD OF MANUFACTURING A CIRCUIT BOARD |
| 摘要 |
A method of manufacturing a circuit board includes providing a metal substrate and applying a dielectric layer to the metal substrate and sacrificial bumps on the dielectric layer. The method also includes printing a conductive seed layer on the dielectric layer and the sacrificial bumps and plating a conductive circuit layer onto the conductive seed layer. The method includes removing sections of the conductive seed layer and sections of the conductive circuit layer during a circuit common removal process |
| 申请公布号 |
US2014290058(A1) |
申请公布日期 |
2014.10.02 |
| 申请号 |
US201414301011 |
申请日期 |
2014.06.10 |
| 申请人 |
Tyco Electronics Corporation |
发明人 |
Malstrom Charles Randall;Myers Marjorie Kay;Geiger John Patton |
| 分类号 |
H05K3/04 |
主分类号 |
H05K3/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a circuit board comprising:
providing a metal substrate; applying a dielectric layer to the metal substrate; providing sacrificial bumps on the dielectric layer; printing a conductive seed layer on the dielectric layer and the sacrificial bumps; plating a conductive circuit layer onto the conductive seed layer; and removing sections of the conductive seed layer and sections of the conductive circuit layer during a circuit common removal process. |
| 地址 |
Berwyn PA US |
