摘要 |
The invention relates to an electroless aqueous copper plating solution, comprising - a source of copper ions, - a reducing agent or a source of a reducing agent, and - a combination of i) at least one polyamino disuccinic acid, or at least one polyamino monosuccinic acid, or a mixture of at least one polyamino disuccinic acid and at least one polyamino monosuccinic acid, and ii) one or more of a compound which is selected from the group consisting of ethylenediamine tetraacetic acid, N'-(2-Hydroxyethyl)-ethylenediamine-N,N,N'- triacetic acid, and &Ngr;,&Ngr;,&Ngr;',&Ngr;'-Tetrakis (2-hydroxypropyl)ethylenediamine, as complexing agents, as well as to a method for electroless copper plating utilizing said solution and the use of the solution for the plating of substrates. |
申请人 |
ATOTECH DEUTSCHLAND GMBH |
发明人 |
BRÜNING, FRANK;LANGHAMMER, ELISA;MERSCHKY, MICHAEL;LOWINSKI, CHRISTIAN;SCHULZE, JÖRG;ETZKORN, JOHANNES;BECK, BIRGIT |