| 摘要 |
Provided is a laminate for temporary bonding in semiconductor device manufacture which is capable of reliably and easily providing temporary support for a member (such as a semiconductor wafer) being mechanically or chemically processed, wherein, even in high-temperature processing, said temporary support can easily be removed without damaging the member when processing has been completed; also provided is a semiconductor device manufacturing method. This laminate for temporary bonding in semiconductor device manufacture has (A) a release layer and (B) an adhesive layer, and the release layer (A) includes (a1) a resin (1) which has a softening point of 200°C or greater, and (a2) a resin (2), wherein 5 mass% or more of said resin (2) dissolves at 25°C in at least one of prescribed solvents after curing. |
