| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability of a semiconductor device.SOLUTION: In a semiconductor deice manufacturing method, logic chip (first semiconductor chip) LC and a laminate (second semiconductor chip) MCS are sequentially laminated on a wiring board 2. The logic chip LC is mounted on the wiring board 2 after performing alignment by an alignment mark 50a formed on the wiring board 2 and an alignment mark 50b formed on a surface 3a of the logic chip LC. On the other hand, the laminate MCS is mounted on a rear face 3b of the logic chip LC after performing alignment by an alignment mark 50c formed on the rear face 3b of the logic chip LC and an alignment mark 50d formed on the surface 3a of the laminate MCS. |
