RESIN COMPOSITION, PRIMER LAYER FOR PLATING PROCESS, PRIMER LAYER FOR PLATING PROCESS SUPPORTED BY SUBSTRATE, CURED PRIMER LAYER FOR PLATING PROCESS, LAMINATE FOR WIRING BOARD, METHOD OF PRODUCING LAMINATE FOR WIRING BOARD, MULTILAYER WIRING BOARD, AND METHOD OF PRODUCING MULTILAYER WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a primer layer for the plating process which has excellent adhesion to electroless plating copper even with a resin surface of small surface roughness and good laser processability, a laminate for wiring board having the primer layer for the plating process, and a multilayer wiring board having the primer layer for the plating process.SOLUTION: A primer layer for the plating process comprises (A) a polyfunctional epoxy resin, (B) an epoxy resin hardening agent, (C) a polybutadiene-modified polyamide resin containing phenolic hydroxy groups, and (D) an inorganic filler of a specific surface area of 20 m/g or larger. The polyfunctional epoxy resin (A) may be an aralkyl novolac type epoxy resin having a biphenyl structure. The inorganic filler (D) may be at least one selected from silica and alumina.