发明名称 |
METHOD FOR MANUFACTURING ELECTRONIC DEVICES |
摘要 |
An embodiment for manufacturing electronic devices is proposed. The embodiment includes the following phases: a) forming a plurality of chips in a semiconductor material wafer including a main surface; each chip includes respective integrated electronic components and respective contact pads facing the main surface; said contact pads are electrically coupled to the integrated electronic components; b) attaching at least one conductive ribbon to at least one contact pad of each chip; c) covering the main surface of the semiconductor material wafer and the at least one conductive ribbon with a layer of plastic material; d) lapping an exposed surface of the layer of plastic material to remove a portion of the plastic material layer at least to uncover portions of the at least one conductive ribbon, and e) sectioning the semiconductor material wafer to separate the chips. |
申请公布号 |
US2014291850(A1) |
申请公布日期 |
2014.10.02 |
申请号 |
US201414228370 |
申请日期 |
2014.03.28 |
申请人 |
STMicroelectronics S.r.I. |
发明人 |
ZIGLIOLI Federico Giovanni |
分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Agrate Brianza IT |