SEMICONDUCTOR PACKAGE HAVING GROUNDING MEMBER AND METHOD OF MANUFACTURING THE SAME

摘要

A semiconductor package and method of manufacture are provided. The semiconductor package may include a package substrate, a semiconductor chip, a molding member and a grounding member. The package substrate may include a ground pad and a signal pad. The semiconductor chip may be arranged on an upper surface of the package substrate. The semiconductor chip may be electrically connected with the signal pad of the package substrate. The molding member may be formed on the upper surface of the package substrate to cover the semiconductor chip. The grounding member may be arranged on a surface of the molding member. The grounding member may be electrically connected with the ground pad.

主权项

1. A semiconductor package comprising:
a package substrate having a ground pad and a signal pad; a semiconductor chip arranged on an upper surface of the package substrate, the semiconductor chip electrically connected to the signal pad of the package substrate; a molding member formed on the upper surface of the package substrate to cover the semiconductor chip; and a grounding member arranged on a surface of the molding member, the grounding member electrically connected to the ground pad, wherein the semiconductor chip has a ground pattern electrically connected to the ground pad, and the molding member has an opening configured to expose the ground pattern of the semiconductor chip, wherein the grounding member comprises: a ground layer formed on the surface of the molding member; and a ground contact formed in the opening, the ground contact electrically connected to the ground pattern of the semiconductor chip.