发明名称 |
LAMINATE, LAMINATED SHEET, PRINTED CIRCUIT BOARD, AND PRODUCTION METHOD FOR LAMINATE AND LAMINATED SHEET |
摘要 |
The purpose of the present invention is to provide a laminate and a laminated sheet having ample heat resistance and adhesion between a glass substrate layer and a resin composition layer, and a production method for the same. A further purpose is to provide a printed circuit board employing the laminate or laminated sheet. [Solution] The laminate has one or more resin composition layers and one or more glass substrate layers, the resin composition layer containing a polyamide-imide resin and an epoxy resin. Also provided are a laminated sheet obtained through curing of the resin composition layer of this laminate, and a printed circuit board employing the laminate or laminated sheet. |
申请公布号 |
WO2014157468(A1) |
申请公布日期 |
2014.10.02 |
申请号 |
WO2014JP58766 |
申请日期 |
2014.03.27 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
YAMAZAKI, YUKA;AOSHIMA, MASAHIRO;SHIMAZAKI, TOSHIKATSU;MURAI, HIKARI |
分类号 |
B32B17/10;C08G73/14;C08L63/00;C08L79/08;H05K1/03;H05K3/46 |
主分类号 |
B32B17/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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