发明名称 LAMINATE, LAMINATED SHEET, PRINTED CIRCUIT BOARD, AND PRODUCTION METHOD FOR LAMINATE AND LAMINATED SHEET
摘要 The purpose of the present invention is to provide a laminate and a laminated sheet having ample heat resistance and adhesion between a glass substrate layer and a resin composition layer, and a production method for the same. A further purpose is to provide a printed circuit board employing the laminate or laminated sheet. [Solution] The laminate has one or more resin composition layers and one or more glass substrate layers, the resin composition layer containing a polyamide-imide resin and an epoxy resin. Also provided are a laminated sheet obtained through curing of the resin composition layer of this laminate, and a printed circuit board employing the laminate or laminated sheet.
申请公布号 WO2014157468(A1) 申请公布日期 2014.10.02
申请号 WO2014JP58766 申请日期 2014.03.27
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 YAMAZAKI, YUKA;AOSHIMA, MASAHIRO;SHIMAZAKI, TOSHIKATSU;MURAI, HIKARI
分类号 B32B17/10;C08G73/14;C08L63/00;C08L79/08;H05K1/03;H05K3/46 主分类号 B32B17/10
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