发明名称 METHOD OF IMPLEMENTING LOW DOSE IMPLANT IN A PLASMA SYSTEM
摘要 <p>Methods of decreasing the dose per pulse implanted into a workpiece disposed in a process chamber are disclosed. According to one embodiment, the plasma is generated by a RF power supply. This RF power supply may have two different modes, a first, referred to as continuous wave mode, where the RF power supply is continuously outputting a voltage. This mode allows creation of the plasma within the process chamber. During the second mode, referred to as pulsed plasma mode, the RF power supply outputs two different power levels. The platen bias voltage may be a more negative value when the lower RF power level is being applied. In a further embodiment, a delay is introduced between the transition to pulsed plasma mode and the initiation of the implanting process. In another embodiment the plasma is generated at a location in the chamber more judicious to reducing the dose per pulse.</p>
申请公布号 WO2014159530(A1) 申请公布日期 2014.10.02
申请号 WO2014US24017 申请日期 2014.03.12
申请人 VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC. 发明人 KOO, ILWONG;LEE, JUN;SRIVASTAVA, ASEEM K.
分类号 H01L21/265;C23C16/513;H01L21/02 主分类号 H01L21/265
代理机构 代理人
主权项
地址