| 摘要 |
PROBLEM TO BE SOLVED: To achieve enhancing curability of a resin composition and a photosensitive composition suitably used for forming a surface protective film and an interlayer insulator which electronic parts and the like have, and reducing an internal stress remaining on a board when forming a cured film on the board using the composition.SOLUTION: There is provided a photosensitive composition containing (A) a resin having a phenolic hydroxyl group, (B1) a crosslinking agent having at least two oxazoline groups, (B2) a crosslinking agent having at least two groups represented by -CHOR, where R is a hydrogen atom, an alkyl group or an acetyl group having 1 to 10 carbon atoms, and (C) a photosensitive acid generator. |
