| 发明名称 |
RESIN COMPOSITION WITH HIGH DIELECTRIC INSULATION PROPERTIES |
| 摘要 |
Provided is a resin composition with high dielectric insulation properties that has a dielectric constant of at least 20, a dielectric tangent of 0.1 or less, outstanding insulation properties (at least 1012 Ω·cm), and for use in electrical power, communication devices, and the like. A resin composition with high dielectric insulation properties comprises a constituent (A), which is 100 parts by mass of a polymer material that acts as a dispersion medium for constituent (B), and a constituent (B), which is 100-3000 parts by mass of a perovskite complex oxide powder comprising secondary particles formed by the mutual bonding of primary particles through sintering and represented by the formula: ABO3. |
| 申请公布号 |
US2014296387(A1) |
申请公布日期 |
2014.10.02 |
| 申请号 |
US201314357411 |
申请日期 |
2013.01.24 |
| 申请人 |
Momentive Performance Materials Japan LLC |
发明人 |
Matsukura Toshihiko;Iijima Hiroyoshi;Shimakawa Masanari |
| 分类号 |
H01B3/10 |
主分类号 |
H01B3/10 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A high dielectric insulating resin composition, comprising:
a component (A): 100 parts by mass of a polymeric material serving as a dispersing medium of a component (B), and the component (B): 100 to 3000 parts by mass of a perovskite-type composite oxide powder which includes secondary particles obtained by primary particles bonded to each other by sintering, and which is represented by the formula: ABO3. |
| 地址 |
Minato-ku, Tokyo JP |
