发明名称 |
METHOD FOR DETECTING HEAT GENERATION POINTS AND DEVICE FOR DETECTING HEAT GENERATE POINTS |
摘要 |
A heat generation point detection method comprises: step of stabilizing an average temperature of a surface of an integrated circuit S; steps of applying a bias voltage of a low frequency to the integrated circuit S and acquiring a heat generation detection signal detected from the integrated circuit S in response thereto; steps of supplying a bias voltage of a high frequency and acquiring a heat generation detection signal detected in response thereto; steps of detecting a phase shift between the bias voltage of the low frequency and the heat generation detection signal and a phase shift between the bias voltage of the high frequency and the heat generation detection signal; and step of calculating a change rate of the phase shift against a square root of the frequency of the bias voltage, and obtaining depth information of the heat generation point from the change rate. |
申请公布号 |
US2014294038(A1) |
申请公布日期 |
2014.10.02 |
申请号 |
US201214355596 |
申请日期 |
2012.08.31 |
申请人 |
Nakamura Tomonori |
发明人 |
Nakamura Tomonori |
分类号 |
G01K13/00;G01K17/00 |
主分类号 |
G01K13/00 |
代理机构 |
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代理人 |
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主权项 |
1. A method for detecting a depth of a heat generation point in an integrated circuit, comprising steps of:
stabilizing an average temperature of a surface of the integrated circuit; supplying a first electric signal at a first frequency the integrated circuit; detecting a first detection signal indicative of a change of an amount of heat generation detected from the integrated circuit in response the first electric signal; supplying a second electric signal at a second frequency different from the first frequency to the integrated circuit; detecting a second detection signal indicative of a change of an amount of heat generation detected from the integrated circuit in response the second electric signal; and obtaining depth information of the heat generation point, based on the first and second detection signals. |
地址 |
Hamamatsu-shi JP |