发明名称 LASER DIODE MOUNTING SUBSTRATE FOR AUTOMOTIVE LAMP MODULE
摘要 Provided is a laser diode mounting substrate for an automotive lamp module using a laser diode. The substrate includes: a substrate body with a power supply circuit pattern, which electrically connects a connector with a contact point of the laser diode, on the top; a first heat conduction layer disposed at the area except for the power supply circuit pattern, on the top of the substrate body; and a second heat conduction layer disposed on the bottom of the substrate body, in which at least one heat transfer hole is disposed through the first heat conduction layer, the substrate body, and the second heat conduction layer. Therefore, the present invention provides an effect that heat generated by the laser diode can be effectively dissipated.
申请公布号 US2014294025(A1) 申请公布日期 2014.10.02
申请号 US201414166949 申请日期 2014.01.29
申请人 HYUNDAI MOBIS CO., LTD. 发明人 LEE Tae Won
分类号 H01S5/024;F21S8/10 主分类号 H01S5/024
代理机构 代理人
主权项 1. A laser diode mounting substrate for an automotive lamp module using a laser diode, the substrate comprising: a substrate body with a power supply circuit pattern, which electrically connects a connector with a contact point of the laser diode, on the top; a first heat conduction layer disposed at the area except for the power supply circuit pattern, on the top of the substrate body; and a second heat conduction layer disposed on the bottom of the substrate body, wherein at least one heat transfer hole is disposed through the first heat conduction layer, the substrate body, and the second heat conduction layer.
地址 Seoul KR
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