MICROELECTRONIC DEVICE ATTACHMENT ON A REVERSE MICROELECTRONIC PACKAGE

摘要

The present description relates to the field of fabricating microelectronic structures. The microelectronic structure may include a microelectronic substrate have an opening, wherein the opening may be formed through the microelectronic substrate or may be a recess formed in the microelectronic substrate. A microelectronic package may be attached to the microelectronic substrate, wherein the microelectronic package may include an interposer having a first surface and an opposing second surface. A microelectronic device may be attached to the interposer first surface and the interposer may be attached to the microelectronic substrate by the interposer first surface such that the microelectronic device extends into the opening. At least one secondary microelectronic device may be attached to the interposer second surface.

主权项

1. A microelectronic structure, comprising:
a microelectronic substrate having an opening therein; and a microelectronic package comprising a microelectronic interposer having at least one microelectronic device electrically attached to a first surface of the microelectronic interposer, wherein the microelectronic package is electrically attached to the microelectronic substrate by the microelectronic interposer first surface and wherein the microelectronic device extends at least partially into the microelectronic substrate opening.