| 摘要 |
<p> To provide a resin composition that allows excellent adhesive strength to be displayed and separation of cured material in a high-temperature process to be suppressed in the manufacture of a semiconductor device. The present invention pertains to: a resin composition comprising (A) an inorganic filler, (B) a thermosetting resin, (C) a curing agent, (D) (D1) a metal salt of an organic acid having a boiling point of 200℃ or greater and/or (D2) a combination of an organic acid having a boiling point of 200℃ or greater and metal particles and/or metal oxide particles, and (E) a polysulfide compound; or a resin composition comprising (A) an inorganic filler, (B) a thermosetting resin, (C) a curing agent, (D) (D1) a metal salt of an organic acid having a boiling point of 200℃ or greater and/or (D2) a combination of an organic acid having a boiling point of 200℃ or greater and metal particles and/or metal oxide particles, and (E') a secondary antioxidant; a die-attach paste or heat-release member adhesive containing the resin composition; and a semiconductor device produced using the die-attach paste or heat-release member adhesive.</p> |
