COOLING BODY FOR SEMICONDUCTOR LIGHTING DEVICE WITH PLASTICS PARTS

摘要

The cooling body (11) is provided for a semiconductor lighting device (H), wherein the cooling body (11) comprises at least: a first plastics part (12), which has a receptacle space (13) open at the rear side; and a second plastics part (14), which is connected to the first plastics part (12) at the front side (15) thereof and is provided for arranging at least one semiconductor light source (22), wherein the first plastics part (12) has a lower thermal conductivity than the second plastics part (14) and at least one insert (18) having a higher thermal conductivity than the second plastics part (14) is present in the cooling body. A semiconductor lighting device comprises such a cooling body (11).