发明名称 |
THREE-DIMENSIONALLY MOUNTED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME |
摘要 |
<p>A three-dimensional mounting semiconductor device includes a layer structure including a plurality of first substrates with a trench-shaped concavity formed in and a plurality of second substrates with semiconductor elements formed in, which are alternately stacked, wherein an unevenness defined by a size difference between the first substrate and the second substrate is formed on a side surface, and a first through-hole are defined by an inside surface of the trench-shaped concavity and a surface of the first substrate, and a third substrate jointed to the side surface of the layer structure and having an unevenness formed on a surface jointed to the layer structure which are engaged with the unevenness formed on the side surface of the layer structure.</p> |
申请公布号 |
EP2693475(A4) |
申请公布日期 |
2014.10.01 |
申请号 |
EP20110862688 |
申请日期 |
2011.03.31 |
申请人 |
FUJITSU LIMITED |
发明人 |
MIZUNO, YOSHIHIRO;KOUMA, NORINAO;TSUBOI, OSAMU |
分类号 |
H01L25/065;H01L23/473;H01L25/07;H01L25/18 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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