发明名称 |
THERMALLY REACTIVE RESIST MATERIAL, METHOD FOR PRODUCING MOLD, MOLD, DEVELOPING METHOD, AND PATTERN-FORMING MATERIAL |
摘要 |
<p>A heat-reactive resist material contains copper oxide, and silicon or silicon oxide, and is formed so that the content of silicon or silicon oxide in the heat-reactive resist material is 4.0 mol% or more less than 10.0 mol% in terms of mole of silicon. A heat-reactive resist layer is formed using the heat-reactive resist material, is exposed, and then, is developed with a developing solution. Using the obtained heat-reactive resist layer as a mask, dry etching is performed on a substrate with a f luorocarbon to manufacture a mold having a concavo-convex shape on the substrate surface. At this point, it is possible to control a fine pattern comprised of the concavo-convex shape.</p> |
申请公布号 |
EP2784587(A1) |
申请公布日期 |
2014.10.01 |
申请号 |
EP20120851615 |
申请日期 |
2012.11.16 |
申请人 |
ASAHI KASEI E-MATERIALS CORPORATION |
发明人 |
MITAMURA, YOSHIMICHI;NAKATA, TAKUTO |
分类号 |
G03F7/075;B29C33/38;B29C59/02;G03F7/004;G03F7/32;G11B7/00;H01L21/027 |
主分类号 |
G03F7/075 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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