| 摘要 |
<p>A device (2) having at least one connecting element (24, 26) for fastening a component (4) to, respectively for detaching it from a component carrier (6) using adhesive bonds; a mechanical peeling device (8) being provided for breaking the adhesive bonds. Also a method for fastening a component (4) to, respectively for detaching it from a component carrier (6).</p> |
