| 摘要 |
<p>Disclosed are a device to align a semiconductor package, a device to cut and align a semiconductor package, and a method for cutting and aligning a semiconductor package which align a semiconductor package on an alignment table. According to an embodiment of the present invention, a device to align a semiconductor package includes a first alignment table having a loading groove on which a semiconductor package is loaded and the position is aligned and a first loading unit having an unloaded area, on which the semiconductor package is not loaded, alternately formed along directions of an x-axis and a y-axis, and moving along a transfer rail of the first alignment table; a second alignment table having a loading groove on which the semiconductor package is loaded and the position is aligned and a second loading unit having an unloaded area, on which the semiconductor package is not loaded, alternately formed along directions of an x-axis and a y-axis, and moving along a transfer rail of the second alignment table; a loading picker absorbing and transferring the semiconductor package on the first alignment table or the second alignment table; a tray in which the semiconductor package absorbed and transferred by the loading picker is stored; and a transfer rail connection unit connecting the transfer rail of the first alignment table and the transfer rail of the second alignment table.</p> |
