APPARATUS AND METHOD FOR LAMINATING OF PRINTED CIRCUIT BOARD

摘要

The present invention relates to an apparatus for laminating a printed circuit board (PCB), capable of preventing generation of bubbles between a PCB and a laminate film. The apparatus for laminating a PCB comprises a temporary bonder temporarily bonding a laminate film to a PCB including a vacuum line with vacuum holes; and a permanent bonder permanently bonding a laminate film to the PCB with the laminate film temporarily bonded thereto, wherein the temporary bonder comprises a laminate film supply roll supplying a laminate film; a front end bonding roller temporarily bonding a front end of the PCB transferred by a transfer roller to the laminate film; a guide roller pressing and guiding the temporarily bonded PCB; a clamp picking the guided PCB and pulling the PCB such that tensile force is generated on the laminate film; and a vacuum pipe connected to the vacuum line such that the vacuum holes formed on the surface of the PCB vacuum-adsorb the laminate film.