摘要 |
<p>PURPOSE: A semiconductor device transfer method in a test handler is provided to sufficiently utilize an pick and place apparatus with a temporary loading element as a medium, thereby improving loading speed by reducing the overall moving distance of the pick and place apparatus. CONSTITUTION: A buffer loading element(41) and a temporary loading element(42) are included between a customer tray(C.T) and a carrier board(C.B). An alignment table(43) is placed between the buffer loading element, temporary loading element, and carrier board. The buffer loading element and temporary loading element is arranged side by side in left and right directions. 22×8 semiconductor devices are loaded in a 22×8 array form in the customer tray. 16×16 semiconductor devices are loaded in a 16×16 array form in the carrier board.</p> |