Electroless copper plating solution

摘要

The invention relates to an electroless aqueous copper plating solution, comprising
- a source of copper ions,
- a reducing agent or a source of a reducing agent, and
- a combination of
i) at least one polyamino disuccinic acid, or at least one polyamino monosuccinic acid, or a mixture of at least one polyamino disuccinic acid and at least one polyamino monosuccinic acid, and
ii) one or more of a compound which is selected from the group consisting of ethylenediamine tetraacetic acid, N'-(2-Hydroxyethyl)-ethylenediamine-N,N,N'-triacetic acid, and N,N,N',N'-Tetrakis (2-hydroxypropyl)ethylenediamine,
as complexing agents,
as well as to a method for electroless copper plating utilizing said solution and the use of the solution for the plating of substrates.