| 摘要 |
The present invention relates to a headlamp module with improved heat dissipating performance and assembling efficiency. According to the present invention, the headlamp module includes a base having an upper surface and a lower surface; a light-emitting diode installed on the upper surface of the base; a heat dissipating pin expanded in a direction getting further away from the lower surface of the base; one or more lower connecting guides formed on the upper surface except the area in which the light-emitting diode is installed; a reflector frame having a reflector covering the light-emitting diode, and having an upper surface and a lower surface; a heat dissipating pin expanded in a direction getting further away from the upper surface of the reflector frame; and an upper connecting guide formed on the lower surface of the reflector frame, wherein the lower connecting guide and the upper connecting guide are connected. |
