| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can restrain small current wiring from having electrical continuity with portions where a larger current than in itself flows. <P>SOLUTION: A semiconductor device 100 comprises a semiconductor chip 10 including an emitter pad 12a and a collector pad 12b where a large current flows and small current wiring (131, 133, 134) where a small current flows, a collector terminal 30 consisting of a metal electrically connected to the collector pad 12b, and a second member (block body 50 and emitter terminal 20) consisting of a metal electrically connected to the emitter pad 12a, the semiconductor chip 10, the block body 50, the emitter terminal 20 and the collector terminal 30 being molded as an integral structure with mold resin 60. The second member (block body 50 and emitter terminal 20) of this device is partly exposed to the outside of the mold resin 60, and has a slit part 51 provided at a position opposed to an insulating protective film 80 covering the small current wiring (131, 133, 134). <P>COPYRIGHT: (C)2013,JPO&INPIT |
