| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device and a manufacturing method of a mounting board of the light-emitting device, which achieve high light-emitting efficiency of an LED light-emitting device, improve productivity, and prevent corrosion of a plated layer and reduction of a reflection ratio. <P>SOLUTION: An LED light-emitting device has an LED 1 mounted on a mounting substrate 2 provided with a die bond electrode 3 and a wire bond electrode 4. An Ag plated layer having excellent reflectivity is formed on the die bond electrode 3 and an Au plated layer having excellent bondability is formed on the wire bond electrode 4. The bonding substrate 2 is covered by an SiO2 film 6 covering the Ag plated layer and exposing the Au plated layer. The LED is die bonded on the SiO2 film 6 covering the Ag plated layer and each electrode of the LED is wire bonded to the Au plated layer exposed on the SiO2 film 6. <P>COPYRIGHT: (C)2012,JPO&INPIT |
