| 摘要 |
The present disclosure relates to an electronic apparatus 100 (figure 1b) comprising a backplane 120, a chassis 101 having plural walls and a circuit board 140 fastened to a wall of the chassis, a surface of the circuit board having a plurality of conductive pads, the backplane is fastened to the chassis perpendicular to the circuit board, the backplane has a connector 130 at an edge of the backplane, the connector comprising a plurality of sprung conductive elements 132 which extend outwards beyond the edge of the backplane to make electrical contact with conductive pads on the circuit board. A front panel with an interface may be connected to the circuit boards so that a connection is made between the panel and the backplane. A ridge may be formed on the chassis and the backplane may be recessed and the ridge and recess may be keyed for assembly. The backplane may be a midplane and may be connected to modules 104 (figure 1b) in its front and its back. |
