| 摘要 |
PROBLEM TO BE SOLVED: To provide a pressure sensitive adhesive sheet for an electronic component, in which, even when a further miniaturized electronic component is diced, the accuracy of the diced electronic component is not deteriorated, and which can naturally be stripped only by applying heat. SOLUTION: In the pressure sensitive adhesive sheet having a thermally expandable adhesive layer comprising thermally expandable particles and an adhesive on a base film, the base film includes: a heat-shrinkable film, an adhesive layer, and a non-heat-shrinkable film in this order; the thermally expandable adhesive layer has a thickness of 2μm or more and less than 20μm and is formed on the surface without the adhesive layer of the non-heat-shrinkable film of the base film; the adhesive layer has a thickness of 0.5 to 10μm, a storage elastic modulus (G') of 1.00×10<SP>5</SP>or more at 15°C, and a storage elastic modulus (G') of 1.00×10<SP>3</SP>or more at 100°C; and the tanδmaximum temperature is 5°C or more. COPYRIGHT: (C)2011,JPO&INPIT |
